• T-Clad Product Overview
• Dielectrics
  • Selection
  • Characteristics
  • Summary
  • Product Family FAQ's
• Base Metal Layer
• Optimal Design
  • Cost Effective Materials
  • Circuit Design
  • Part Fabrication
  • Design Guidelines
  • Electrical Design
  • Advanced Processes
• LEDs
  • Introduction
  • Temp. Effect
  • PCB Comparison
  • HPL
  • T-Clad PA
  • TIM Solutions
  • Standard Configurations
• Reliability Testing
• Applications
• Specialty Applications
• IsoEdge Heat Plate
• Assembly Recommendations
• Awards and Certifications
• T-Clad Selection Guide
• LED Solutions Brochure
• T-Clad Optimal Design White Paper
• Assembly Resources
  

HPL (High Power Lighting)

HPL is specifically formulated for high power lighting LED applications with demanding thermal performance requirements.

Optimal Design - Advanced Processes

Part Forming
Thermal Clad is designed with a copper or aluminum base plate that can be formed. In order to maintain thermal and electrical integrity, circuits cannot go across the bent area.


Dielectric Removal in Motor Control Application

Thermal Clad is a versatile substrate. In this motor control application, the dielectric has been selectively removed and the metal has been formed with three-dimensional features.

Selective Dielectric Removal
Bergquist has developed a process for selectively removing dielectric to expose the baseplate. This surface can be surface finished like the other circuit pads.We are not limited to geometry or size of the dielectric removal area. Selective removal features can be placed very accurately with respect to the circuits.

Selective dielectric removal.

Pedestal
Using a copper base and by selectively removing the dielectric a pedestal can be formed moving the base metal up to be co-planar with adjacent circuits.

Pedestal formation through selective dielectric removal