• T-Clad Product Overview
• Dielectrics
  • Selection
  • Characteristics
  • Summary
  • Product Family FAQ's
• Base Metal Layer
• Optimal Design
  • Cost Effective Materials
  • Circuit Design
  • Part Fabrication
  • Design Guidelines
  • Electrical Design
  • Advanced Processes
• LEDs
  • Introduction
  • Temp. Effect
  • PCB Comparison
  • HPL
  • T-Clad PA
  • TIM Solutions
  • Standard Configurations
• Reliability Testing
• Applications
• Data Sheets
• IsoEdge Heat Plate
• Assembly Recommendations
• Awards and Certifications
• T-Clad Selection Guide
• LED Solutions Brochure
• T-Clad Optimal Design White Paper
• Assembly Resources
  

HPL (High Power Lighting)

HPL is specifically formulated for high power lighting LED applications with demanding thermal performance requirements.

T-Clad Selection Guide

Comprehensive Thermal Clad Selection Guide
This document includes ALL information for thermal substrates. To view individual chapters, click on one of the following links.

Thermal Clad Overview Thermal Clad Applications Thermal Clad Reliability Selecting Dielectric Materials Dielectric Performance Characteristics Summary of Dielectric Characteristics Advanced Circuit Processing Baseplate Design Considerations Selecting A Circuit Layer Electrical Design Considerations Assembly Recommendations Other Bergquist Thermal Products Appendix Thermal Clad Configurations

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