HPL is specifically formulated for high power lighting LED applications with demanding thermal performance requirements.

T-Clad Selection Guide

	Comprehensive TClad Selector Guide
	Thermal Clad Overview This chapter provides features and the anatomy of Thermal Clad products.
	Thermal Clad Applications This chapter provides information on typical applications of Thermal Clad products.
	Thermal Clad Reliability Information on long-term reliability testing.
	Selecting Dielectric Materials An overview of dielectric performance.
	Summary of Dielectric Characteristics A summary of all Bergquist Thermal Clad products' dielectric characteristics.
	Using Thermal Clad Dielectric Materials Information on specialty applications.
	Selecting a Base Layer This chapter provides parameters for selecting the appropriate base layer material.
	Selecting a Circuit Layer Information on current carrying capabilities, heat spreading capabilities, and flatness in relation to thickness.
	Dielectric Performance Characteristics A series of charts outlining important dielectric properties
	Electrical Design Considerations This chapter provides information regarding electrical design considerations, including proof testing, breakdown voltage, and creepage distance and discharge.
	Assembly Recommendations This chapter provides information on solder assembly and connection techniques.
	Other Bergquist Thermal Products Information on the full line of Bergquist thermal management products.
	Appendix The Appendix contains a list of test methods.
	Thermal Clad Configurations See the custom configurations Thermal Clad can be supplied in.