Dielectric Layer The technology of Thermal Clad resides in the dielectric layer. It is the key element for optimizing performance in your application. The dielectric is a proprietary polymer/ceramic blend that gives Thermal Clad its excellent electrical isolation properties and low thermal impedance. The polymer is chosen for its electrical isolation properties, ability to resist thermal aging, and high bond strength. The ceramic filler enhances thermal conductivity and maintains high dielectric strength. The result is a layer of isolation which can maintain these properties even at 0.003" (75µm) thickness. This guide will help you select the best dielectric to suit your needs for watt density, electrical isolation and operating temperature environment. Thermal Clad dielectrics are available in varying thermal conductivity and thicknesses in four types: Low Thermal Impedance, High Temperature, Multi-Purpose and Circuit Material Laminate.
This chart indicates which Bergquist thermal management products are best suited for higher and lower power applications.
